Description
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Metrics
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HWeakness enumeration
Affected software
No affected versions have been published.
Timeline
- Published
- Jul 30, 2020
- Last modified
- Jun 17, 2026
- NVD status
- Modified