CVE-2018-11269

HighCVSS 7.8/10Last modified Jun 17, 2026

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.

Metrics

CVSS 3.0 7.8/10CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weakness enumeration

CWE-129

Affected software

Vendor	Product	Versions
Qualcomm, Inc.	SSnapdragon Automobile, Snapdragon Mobile, Snapdragon Wear	MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016

References

http://www.securityfocus.com/bid/105838Third Party Advisory, VDB Entry
https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
http://www.securityfocus.com/bid/105838Third Party Advisory, VDB Entry
https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory

Timeline

Published: Sep 20, 2018
Last modified: Jun 17, 2026
NVD status: Modified

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