Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Metrics
CVSS 3.0 7.8/10
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:HWeakness enumeration
Affected software
| Vendor | Product | Versions |
|---|---|---|
| Qualcomm Technologies, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | MDM9206; MDM9607; MDM9650; MSM8909W; MSM8996AU; SD 210/SD 212/SD 205; SD 425; SD 450; SD 615/16/SD 415; SD 625; SD 650/52; SD 820; SD 820A; SD 835; SD 845; SDX20 |
References
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
Timeline
- Published
- May 6, 2019
- Last modified
- Jun 17, 2026
- NVD status
- Modified