CVE-2026-21376

HighCVSS 7.8/10Last modified Oct 26, 2026

Description

Memory Corruption when accessing an output buffer without validating its size during IOCTL processing in a camera sensor driver.

Metrics

CVSS 3.1 7.8/10CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weakness enumeration

CWE-126

Affected software

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	AQT1000; Cologne; FastConnect 6200; FastConnect 6700; FastConnect 6800; FastConnect 6900; FastConnect 7800; QCA0000; QCA6391; QCA6420; QCA6430; QCM5430; QCM6490; Qualcomm Video Collaboration VC3 Platform; SC8380XP; SM6250; Snapdragon 460 Mobile Platform; Snapdragon 662 Mobile Platform; Snapdragon 7c Compute Platform; Snapdragon 7c Gen 2 Compute Platform "Rennell Pro"

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.htmlVendor Advisory

Timeline

Published: Apr 6, 2026
Last modified: Oct 26, 2026
NVD status: Analyzed

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