CVE-2025-59606

HighCVSS 7.8/10Last modified Jul 22, 2026

Description

Memory Corruption when writing to invalid memory locations occurs due to heap memory exhaustion during secure data initialization.

Metrics

CVSS 3.1 7.8/10CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weakness enumeration

CWE-476

Affected software

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon	Cologne; FastConnect 6200; FastConnect 6700; FastConnect 6900; FastConnect 7800; G2 Gen 1; IQ6 Series Platform; IQ8 Series Platform; IQ9 Series Platform; LeMans_AU_LGIT; LeMansAU; Monaco_IOT; Netrani; Orne; Palawan25; Pandeiro; QAM8255P; QAM8295P; QAM8620P; QAMSRV1H

References

https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2026-bulletin.htmlVendor Advisory

Timeline

Published: Jun 1, 2026
Last modified: Jul 22, 2026
NVD status: Analyzed

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