CVE-2023-21671

HighCVSS 7.8/10Last modified Jun 17, 2026

Description

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

Metrics

CVSS 3.1 7.8/10CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weakness enumeration

Affected software

VendorProductVersions
Qualcomm, Inc.SnapdragonFastConnect 6700; FastConnect 6900; QCA6391; QCM6490; QCS6490; QSM8350; Qualcomm Video Collaboration VC3 Platform; SD888; SM7315; SM7325P; Snapdragon 778G 5G Mobile Platform; Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); Snapdragon 780G 5G Mobile Platform; Snapdragon 782G Mobile Platform (SM7325-AF); Snapdragon 7c+ Gen 3 Compute; Snapdragon 888 5G Mobile Platform; Snapdragon 888+ 5G Mobile Platform (SM8350-AC); WCD9370; WCD9375; WCD9380

References

Timeline

Published
Nov 7, 2023
Last modified
Jun 17, 2026
NVD status
Modified

Related CVEs from 2023

CVE-2023-21671: High severity, CVSS 7.8 | Vulnix