CVE-2022-22090

HighCVSS 7.8/10Last modified Jun 17, 2026

Description

Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile

Metrics

CVSS 3.1 7.8/10CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Weakness enumeration

CWE-416

Affected software

Vendor	Product	Versions
Qualcomm, Inc.	Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile	SD 8 Gen1 5G, SD865 5G, SD888 5G, SDX65, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

References

https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletinVendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletinVendor Advisory

Timeline

Published: Jun 14, 2022
Last modified: Jun 17, 2026
NVD status: Modified

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